Suomija – Įvairios bendrosios ir specialiosios paskirties mašinos – Semi-Automatic Wafer Grinder
Suomija – Įvairios bendrosios ir specialiosios paskirties mašinos – Semi-Automatic Wafer Grinder
I dalis: Perkančioji organizacija
I.1) Pavadinimas ir adresai:
Oficialus
pavadinimas: VTT Technical Research Centre of Finland Ltd
Adresas: P.O. Box 1000, VTT
Miestas: Espoo
Pašto
kodas: 02044
Šalis: Suomija
Asmuo
ryšiams:
El-paštas: kilpailutus@vtt.fi
Interneto adresas (-ai):
Pagrindinis adresas: https://www.vttresearch.com/fi
II dalis: Objektas
II.1.1) Pavadinimas:
Semi-Automatic Wafer Grinder
Nuorodos numeris: Reg.no. 63/206/2025
II.1.2) Pagrindinis BVPŽ kodas:
42900000
Įvairios bendrosios ir specialiosios paskirties mašinos
II.1.3) Sutarties tipas:
Kita
II.1.4) Trumpas aprašymas:
The object of the tender is a Semi-Automatic Wafer Grinder with manual wafer loading and unloading on the chuck table (later also “Equipment”), capable of thinning Si, SiC, LiNbO3 and other typical semi-conducting wafers of 200 and 300 mm diameter to varying thicknesses with end-point control, TTV profile control, capability to thin wafers down to 10um thickness with supporting tape and capability to grind only a determined distance from edge-to-center. Equipment must be new.
The tool must comply with cleanroom equipment standard safety and contamination requirements.
The object of the tender process is described in more detail in the invitation to tender documents.
II.2) Aprašymas:
II.2.1) Kitas (-i) šio pirkimo BVPŽ kodas (-ai):
42900000 Įvairios bendrosios ir specialiosios paskirties mašinos