Suomija – Tikrinimo ir bandymo aparatai – Conformal sputtering tool for versatile deposition of thin films with high aspect ratio, dielectrics and piezoelectrics, advanced metal alloys, and multilayer stacks

Suomija – Tikrinimo ir bandymo aparatai – Conformal sputtering tool for versatile deposition of thin films with high aspect ratio, dielectrics and piezoelectrics, advanced metal alloys, and multilayer stacks

I dalis: Perkančioji organizacija

I.1) Pavadinimas ir adresai:

Oficialus pavadinimas: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY
Adresas: PL 1000
Miestas: VTT
Pašto kodas: 02044
Šalis: Suomija
Asmuo ryšiams:
El-paštas: kilpailutus@vtt.fi
Interneto adresas (-ai):
Pagrindinis adresas: https://www.vttresearch.com/fi

II dalis: Objektas

II.1.1) Pavadinimas:

Conformal sputtering tool for versatile deposition of thin films with high aspect ratio, dielectrics and piezoelectrics, advanced metal alloys, and multilayer stacks
Nuorodos numeris: 583804

II.1.2) Pagrindinis BVPŽ kodas:

38500000 Tikrinimo ir bandymo aparatai

II.1.3) Sutarties tipas:

Kita

II.1.4) Trumpas aprašymas:

THE SUBJECT OF THE PROCUREMENT The subject of the procurement is a modular and versatile cluster sputtering tool for the deposition of conformal thin films with high aspect ratios. Beside the two conformal sputtering modules, the system is equipped with additional magnetron sputtering and co-sputtering sources for in situ multilayer thin-film deposition of metals, alloys, dielectrics as well as piezoelectrics. DIRECT AWARD, Article 40 2(2) of Finnish Procurement act (1397/2016) The procurement will be carried out as a direct award in accordance with 40 article Section 2(2) of the Finnish Public Procurement Act. Only a certain supplier can implement the procurement for a technical reason, and there are no reasonable alternatives or substitute solutions. The absence of competition is not due to an artificial narrowing of the terms and conditions of the procurement. TECHNICAL REASONS A high-performance 200-mm wafer sputtering cluster tool is required, which is able to deposit conformal thin films with high aspect ratio (8:1 and beyond) on wafer level with industrial quality standard. In addition, the system needs to be equipped to deposit highly textured, uniform and stress-free piezoelectric films, as well as thick dielectrics, standard metals and advanced metal alloys by magnetron (co-)sputtering, and multilayer stacks in situ without vacuum break. In total a minimum of 7 target positions is required, driven by HiPIMS, DC, pDC, RF and RFDC power. Further requirements are co-sputtering, ICP pre-sputter etch, as well as simultaneous processing of fast and very slow processes on different wafers - with room for future extension - to fulfil current and future needs of VTT Micronova’s 200-mm wafer process capability. According to market research, there is no other relevant suppliers capable of supplying the sputter tool for VTT. The more detailed clarification has been made by VTT’s experts about the grounds of direct purchase. To confirm the market analysis, VTT publishes this notification about the declaration of direct purchase.

II.2) Aprašymas:

II.2.1) Kitas (-i) šio pirkimo BVPŽ kodas (-ai):

38500000 Tikrinimo ir bandymo aparatai